Over the years, we have closely followed the development trends in the protection of sensitive electronic components and devices against environmental conditions and effects.
Two-component potting with polyurethane or epoxy resin has been used successfully for decades.
This method enhances heat dissipation, insulation, moisture protection and mechanical resistance.
However, potting has several drawbacks: it is time-consuming, requires the use of “pots” (i.e. cases, shells, housings) and involves processing of hazardous substances in the production of potting compounds.
Hotmelt molding at low injection pressure using polyamide-based pellets provides less heat dissipation compared to potting compounds and a somewhat reduced mechanical resistance than a conventional housing, but it offers convincing benefits such as fast and easy processing and excellent environmental compatibility.
Electronic modules completely encapsulated with hotmelt have been available to our customers since March 2016. Hotmelt molding is also used in cable production for strain relief, sealing and shaping applications of assembled plugs and connectors.