Automatic surface mounting of components on printed circuit boards with flexible Mycronic pick-and-place machines, complemented by the manual assembly of through-hole components, are processes that play a crucial role in the manufacture of many of our products. High-speed automatic surface mounting combined with exceptional flexibility and short retooling times enable us to meet customer requirements in terms of fast delivery and efficient production even for small volumes.
Also available:
UL/CSA-approved products provided in our capacity as manufacturing partner or production of ATEX-certified products with certificate of compliance.
Range of equipment employed (list not exhaustive):
Surface-mount technology (SMT)
- 2 Mycronic pick-and-place machines with AGILIS magazines for fast retooling
- 2 ESSEMTEC paste printers and 2 SMT paste printers for samples and SMD adhesives
- 2 ASSCON vapour-phase soldering systems
Through-hole technology (THT)
- 1 SEHO wave soldering system – lead-free
- 1 EBSO selective soldering system – lead-free
- Various through-hole mounting and soldering stations – lead-free or leaded, if desired
Testing & inspection systems
- 3D-AOI-System Göpel
- Flying Probe Tester SPEA 4040
- PC-controlled EFA Inspection® system (from LSE) for through-hole and mixed technology (SMT/THT)
- Lynx microscopes with large viewing area
- Various functional testing and laboratory equipment
- Programming station for memory, microcontrollers (µCs) and MEMS oscillators
- Computer-controlled Ersa rework station
